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China Unveils World's First Ultra-High Parallel Optical Computing Chip: A New Era in AI & Data Transmission

18 June 2025 by
China Unveils World's First Ultra-High Parallel Optical Computing Chip: A New Era in AI & Data Transmission
Naruto Uzumaki

In a world racing toward AI supremacy, Chinese scientists have just taken a massive leap. Researchers from Fudan University have developed the world’s first ultra-high parallel optical computing chip, boasting an astronomical 38 terabits per second (Tbps) data throughput. This revolutionary innovation could reshape everything from AI model training to hyperscale data centers.


🧠 The Breakthrough: 4.75 Trillion Parameters Per Second

This isn't just an upgrade—it's a quantum leap. The chip can transfer 4.75 trillion parameters every second, a scale that aligns with the needs of large language models (LLMs) like GPT, Claude, or Gemini, which require vast amounts of data to be shared across thousands of computing nodes in real-time.

At its core, the chip uses a silicon photonic integrated high-order mode multiplexer—essentially a next-gen traffic controller for photons.


🔍 How It Works: Triple Multiplexing on Silicon

The key to this monster performance lies in multi-dimensional multiplexing, combining:

  • 🎯 Space-Division Multiplexing (SDM) – Multiple optical paths in one waveguide.
  • 🌈 Wavelength-Division Multiplexing (WDM) – Different wavelengths carry separate data streams.
  • ⏱️ Time-Division Multiplexing (TDM) – Rapid time-sliced data packets.

Together, these allow simultaneous, low-power, high-efficiency optical data transmission—all built on a CMOS-compatible silicon photonics platform, making it viable for large-scale manufacturing.


🌐 Why This Matters: From AI to Supercomputing

This chip isn’t just about speed—it’s about redefining what's possible:

⚙️ 1. AI & Machine Learning

Training AI models with hundreds of billions of parameters requires intense parallel processing and communication. This chip provides the infrastructure to scale beyond today's limits, eliminating bandwidth bottlenecks.


🧬 2. Data Centers & HPC (High-Performance Computing)

Optical interconnects can drastically cut energy use, reduce latency, and increase computing density—critical for next-gen data centers, supercomputers, and even exascale computing.


🧠 3. Towards Optical Neural Networks

This breakthrough pushes us one step closer to all-optical computing systems, where both memory and logic can be handled using light instead of electricity.


📍 China's Broader Push in Optical & Photonic Chips

This chip is part of a broader wave of Chinese innovation in photonic and quantum hardware, including:

  • TAICHI Optical AI Chip by Tsinghua University – Delivers 160 TOPS/W, enabling AGI-scale networks with ultra-efficiency.
  • Photonic Quantum Chips – Exploring entanglement, cluster states, and quantum logic on silicon.
  • Photonic Clock Chips from Peking University – Enabling precision timing for 5G/6G, quantum sensing, and defense tech.

China isn’t just catching up—it’s setting the pace.


🔮 What’s Next?

While commercialization will take time (estimates range from 3–5 years), the optical computing ecosystem is maturing fast. The main challenge remains integration—bringing together optical chips, electronic processors, and efficient packaging into unified systems.

Still, the roadmap is clear: this is the beginning of a shift from electronic bottlenecks to photon-powered computing.


🏁 Final Thoughts

The launch of this ultra-high parallel optical computing chip is a giant step toward future-proofing AI and big data infrastructure. With 38 Tbps bandwidth, CMOS compatibility, and unprecedented parallelism, this chip isn’t just about speed—it’s about enabling the AI of tomorrow.

🌐 From data centers to AI superbrains—light, not electricity, may soon drive our digital world.

in TECH
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